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Kester speciality alloy capability

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Kester is dedicated to producing high quality solder products meeting our customers’ application driven requirements. A few of the most common alloys used by the electronic assembly market are shown below. However, if you have a need for a low melting solder alloy (<350°C) not shown below, containing elements such as Tin (Sn), Lead (Pb), Silver (Ag), Bismuth (Bi), Antimony (Sb) or Copper (Cu),contact our customer service department with your requirements. Chances are that Kester has made it before. Speciality alloys can often be produced in several forms including bar, wire, solder preforms and solder paste.


Common alloy temperature chart

Commonly specified solder alloys are shown in the table. The selection of alloy is determined by application, melting temperature and physical properties. The alloys listed may be available in forms other than those indicated.Other solder alloys are also available. Where applicable, Kester solders meet and exceed ASTM B32, QQ-S-571 and IPC/J-STD-006 specifications.


Solder Alloys and available form :



An alloy that exhibits no plastic range upon melting. The melting point is also lower than that of any other alloy composed of the same constituents in different proportions.


A waste product or an impurity, especially an oxide formed on the surface of molten metal.

sweat soldering

To join metal parts by interposing cold solder and then heating. silver leaching

silver leaching

The tendency for tin/lead-bearing solder to dissolve silver-bearing surface metallizations during reflow operations. Ceramic component metallizations often contain silver which is very easily dissolved into tin. The rate at which silver leaches into the molten tin/lead solder alloy is retarded by using solder alloys which contain smaller amounts of silver.


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