isotopee-business

  • Increase font size
  • Default font size
  • Decrease font size
shop on line.

Ultra-Sphere

E-mail Print PDF

Kester’s unique, proprietary manufacturing technology produces spheres smooth, clean surfaces, and tight size distribution. Process characteristics include free flow in placement equipment, resistance to fretting damage (darkening), and exceptional solderability

Last Updated on Monday, 14 February 2011 14:23
 

Worldwide Facilities

E-mail Print PDF

Kester, established in 1899, joins Northrop Grumman’s newly established Component Technologies Sector in 2001. As a leading worldwide manufacturer, supplier, and marketer of soldering materials, Kester maintains 8 modern and The following trademarks are registered in the United States of America:

AQUABOND, BIOKLEEN, COPPER-NU, FLUX-PEN,SE-CURE, SOLDER SAVER, SOLDERFORMS, ULTRAPURE, “44”, EASY PROFILE, ULTRA-SPHERES

.SOLDERFORMS is also registered in Canada.

“44” is also registered in Canada, Hong Kong,Malaysia, Singapore and Taiwan.

ProFlow™ developed from concept by Novatec.EAM v02/17/10/03 efficient manufacturing facilities.

Kester is headquartered in Des Plaines,United States, with additional manufacturing locations in Canada, Germany, Brazil, Singapore,Taiwan, Malaysia and Japan.Kester products and services are used by a wide range of industries such as telecommunications,computer, automotive, military, components manufacturing, and consumer electronics. Throughout the world, Kester products are known for their high quality and advanced technology. Kester’s multiple plants assure quick delivery and protection against regional shipping delays and natural disasters. In addition, Kester has an extensive distributor network which permits easy access to sources of supply for Kester’s fine products.

 

Last Updated on Thursday, 10 March 2011 00:02
 

Bar Solder and Related Products

E-mail Print PDF

The quality of Kester bar solder is guaranteed by using high purity metals and strict quality control standards. Kester extrudes its bar to minimise oxidisation, limit segregation and provide a denser grain structure than cast bar. Kester manufactures bar solder to 3 distinct specifications. Each meets and exceeds requirements of QQ-S-571-F, ASTM B32 and IPC/J-STD-006. Kester Ultra-Low Dross Manufactured using the Ultrapure® process and containing the same metal purity as Kester Ultrapure®, Kester Ultra Low Dross is formulated with a special low dross additive which dramatically decreases dross formation on the solder pot. Lower dross formation decreases joint weakening inclusions in the solder, keeps surface tension low and decreases costly solder loss through drossing. Kester Ultrapure® Made by a special process which controls the inclusion of oxides and metallic and nonmetallic impurities, Kester Ultrapure® is the industry standard bar solder for use in high tech electronics applications where lower surface tension and hole filling ability are essential. The purity of Kester Ultrapure® far exceeds the requirements of QQ-S-571-F, ASTM B32 and IPC/J-STD-006. Kester E-Bar Designed for electrical, electronic and mechanical applications requiring bar solder that meets or exceeds the requirements of QQ-S-571-F, ASTM B32 and IPC/J STD-006. Kester 5744 Solder Saver® A chloride-free, inorganic white powder formulated to remove dross, which is the oxide of solder, from still solder pots and wave soldering machines. It does not decompose to sticky residues that are harder to remove than the original dross. The is low fuming and is stable at molten solder temperatures. Sold in increments of 10 lbs. Solder analysis program The Kester solder analysis program is prepaid method for solder sample analysis . It allows customers to document solder pot impurities for conformance to Federal specifications or ISO quality requirements. Customers purchase prepaid mailers and then simply insert a solder sample into the mailer and return it to Kester.

Last Updated on Thursday, 10 March 2011 00:12
 

Kester speciality alloy capability

E-mail Print PDF

Kester is dedicated to producing high quality solder products meeting our customers’ application driven requirements. A few of the most common alloys used by the electronic assembly market are shown below. However, if you have a need for a low melting solder alloy (<350°C) not shown below, containing elements such as Tin (Sn), Lead (Pb), Silver (Ag), Bismuth (Bi), Antimony (Sb) or Copper (Cu),contact our customer service department with your requirements. Chances are that Kester has made it before. Speciality alloys can often be produced in several forms including bar, wire, solder preforms and solder paste.

 

Common alloy temperature chart

Commonly specified solder alloys are shown in the table. The selection of alloy is determined by application, melting temperature and physical properties. The alloys listed may be available in forms other than those indicated.Other solder alloys are also available. Where applicable, Kester solders meet and exceed ASTM B32, QQ-S-571 and IPC/J-STD-006 specifications.

 

Solder Alloys and available form :


Definitions:

eutectic

An alloy that exhibits no plastic range upon melting. The melting point is also lower than that of any other alloy composed of the same constituents in different proportions.

dross

A waste product or an impurity, especially an oxide formed on the surface of molten metal.

sweat soldering

To join metal parts by interposing cold solder and then heating. silver leaching

silver leaching

The tendency for tin/lead-bearing solder to dissolve silver-bearing surface metallizations during reflow operations. Ceramic component metallizations often contain silver which is very easily dissolved into tin. The rate at which silver leaches into the molten tin/lead solder alloy is retarded by using solder alloys which contain smaller amounts of silver.

Last Updated on Thursday, 10 March 2011 00:15
 


Page 2 of 2

Shopping Cart

VirtueMart
Your Cart is currently empty.