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Home FLUX PATEUX TSF-6516
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TSF-6502TSF-6522

TSF-6516
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TSF-6516

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High viscosity. ideal for sphere and pin attachment (BGA, CSP, PGA) flip-chip mounting (FCIP and FCOB) and noclean rework operations. Compatible with air or nitrogen reflow. Residues interact well with many capillary underfill materials. • Stencil or screen printing • Dot dispensing • Thin film applicator 285 poise @ 10 rpm Malcom @25ºC 100 IPC/J-STD-004 Flux designator ROL0 Removal of residue is not required but can be eliminated using Kester #5768 Bio-Kleen® saponifier 10 to 12% solution in de-ionised water at 55 - 65ºC.










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