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Home FLUX PATEUX TSF-6592
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TSF-6522TSF-6805

TSF-6592
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TSF-6592

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Kester TSF-6592 is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BGAs, SMDs, or any Lead Free soldering application that requires a very tacky flux.

Performance Characteristics:

• Compatible with Lead Free alloys such as SnAg, SnCu, SnAgCu, SnAgBi

• Reflow-able with peak temperatures up to 70 °C

• Reflow-able in air and nitrogen

• Bright shiny soldered joints with clear residues

• Aggressive flux on various substrates such as OSP-Cu, Immersion finishes and ENIG

• Clear non-tacky residues

• High tack to minimize skewing of components

• Low voiding

• Stencil Life of 8+ hours (process dependent)

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

RoHS Compliance

This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.


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