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Home FLUX PATEUX TSF-6502
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Test kitTSF-6516

TSF-6502
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TSF-6502

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Kester TSF-6502 is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. The robust wetting action of TSF-6502 will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, TSF-6502 will leave aesthetically pleasing clear residues on the assembly. TSF-6502 is designed for a wide range of temperature and humidity conditions.

Performance Characteristics:

• Stencil life: 8 hours (process dependent)

• Excellent printing characteristics to <16mil

pitch

• Leaves bright/shiny solder joints after reflow

• Can reflow in air or nitrogen environments

• Classified as ROL1 per J-STD-004

• Compliant to Bellcore GR-78


fiche technique(pdf) : TSF-6502 (32,13 KB)








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