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Home FLUX PATEUX TSF-6805
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TSF-6592

TSF-6805
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TSF-6805

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Low voiding for sphere/pin attachment to BGA or PGA substrates. Residue can be exposed to multiple reflow cycles prior to cleaning. Air or nitrogen reflowable. Leaves shiny solder joints after reflow. Low foaming during wash cycles. • Stencil or screen printing • Pin transfer • Rotating drum/doctor blade applicator • Thin film applicator 260 poise @ 10 rpm Malcom @25ºC 85 IPC/J-STD-004 Flux designator ORH0 Residues are best removed using 55 - 65ºC de-ionised water in automated cleaning equipment.










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