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La retouche et la soudure sans plomb d'éléments BGA, CSP, PGA nécessitent de nouveau flux en mesure de supporter des températures élevées sans carboniser et sans rendre difficile l'élimination des résidus de flux.Ces flux pâteux sont formulés pour l’assemblage sans plomb.


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RF742

No-Clean, SnPb, Pb-free, repair flux. Available in 10 or 30 g Syringue. 
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RF771

Water soluble repair flux,SnPb and Pb-free. Available in 10 or 30 g syringue. 
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TSF-6502

No-Clean, SnPb, Pb-free. Available in 10 or 30 g syringue. Kester TSF-6502 is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. 
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TSF-6516

No-Clean SnPb. available in 10 or 30 g syringue. High viscosity. ideal for sphere and pin attachment (BGA, CSP, PGA) flip-chip mounting (FCIP and FCOB) and noclean rework operations. Compatible with air or nitrogen reflow. 
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TSF-6522

No-Clean, SnPb, Pb-free. Available in 10 or 30 g syringue. Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. 
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TSF-6592

No-Clean Pb-free. Available in 10 or 30 g syringue. Kester TSF-6592 is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BG 
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TSF-6805

Water Soluble. Available in 10 or 30 g syringue. Low voiding for sphere/pin attachment to BGA or PGA substrates. 
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