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HM531R276

NXG1

NXG1

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Kester NXG1 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 20 mils without any kneading. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues. This paste also features the longest shelf life of any product in its class at 8 months. NXG1 is ANSI/J-SDTD-005 compliant. The flux is classified as Type ROL1 flux under IPC ANSI/J-STD-004B. • Excellent wetting to a variety of metals • Capable of print speeds up to 200 mm/sec (8 in/sec) • Excellent printing characteristics on 0.4mm (16 mil) pitch QFPs • Excellent release from stencil • Long stencil and tack life (process dependent) • Low voiding behavior • Capable of 120 minute break times in printing • Clean cosmetic aesthetics after reflow • Resistant to slump • Longest shelf life at 8 months • Reflowable in air or nitrogen Standard Applications For stencil printing: 88.5% metal for -325+500 mesh 88.5% metals for -400+500 mesh RoHS Compliance This product meets the requirements of the RoHS (Restriction of Hazardous Substances) Directive, 2002/95/EC Article 4 for the stated banned substances.
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