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Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters.

• Excellent dispensing characteristics using 22 gage needles and Type 3 powder

• Manufactured and packaged void-free to insure the most consistent dispensibility available

• Capable of several thousands of dots per hour in high speed automated dispense equipment

• High activity on all substrates, including OSPs

• Stable tack over 8+ hours

• Available with lead-free alloys

• Compatible with Kester Easy Profile® 256 stenciling solderpaste

• Classified as ROL0 per J-STD-004

• Compliant to Bellcore GR-78

Standard Application

87% Metal -- Dispensing

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