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R276 |
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Kester R276 is a no-clean solder paste specifically designed for optimal characteristics in all types of dispensing applications. R276 is packaged void-free to insure consistent dispensing in high speed automated processes. The flow characteristics of R276 provide for excellent dispensing characteristics with a wide range of needle diameters. • Excellent dispensing characteristics using 22 gage needles and Type 3 powder • Manufactured and packaged void-free to insure the most consistent dispensibility available • Capable of several thousands of dots per hour in high speed automated dispense equipment • High activity on all substrates, including OSPs • Stable tack over 8+ hours • Available with lead-free alloys • Compatible with Kester Easy Profile® 256 stenciling solderpaste • Classified as ROL0 per J-STD-004 • Compliant to Bellcore GR-78 Standard Application 87% Metal -- Dispensing |
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