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TACKY SOLDER FLUX feed

Rework and attachment of lead-free BGA, CSP, PGA requires new flux systems able to sustain higher thermal requirements without charring or rendering flux residue removal difficult. These tacky fluxes are formulated for lead-free assembly.



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RF742

No-Clean, SnPb, Pb-free, repair flux. Available in 10 or 30 g Syringue. 
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RF771

Water soluble repair flux,SnPb and Pb-free. Available in 10 or 30 g syringue. 
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TSF-6502

No-Clean, SnPb, Pb-free. Available in 10 or 30 g syringue. Kester TSF-6502 is a no-clean tacky soldering flux formula that possesses a high activity level, allowing it to solder nickel surfaces. 
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TSF-6516

No-Clean SnPb. available in 10 or 30 g syringue. High viscosity. ideal for sphere and pin attachment (BGA, CSP, PGA) flip-chip mounting (FCIP and FCOB) and noclean rework operations. Compatible with air or nitrogen reflow. 
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TSF-6522

No-Clean, SnPb, Pb-free. Available in 10 or 30 g syringue. Kester TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. 
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TSF-6592

No-Clean Pb-free. Available in 10 or 30 g syringue. Kester TSF-6592 is a No Clean Paste Flux designed as a Lead Free Solution for an array of Lead Free interconnect applications such as flip chip attach, sphere or ball attach, rework/repair of CSPs, BG 
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TSF-6805

Water Soluble. Available in 10 or 30 g syringue. Low voiding for sphere/pin attachment to BGA or PGA substrates. 
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Last Updated: Tuesday, 22 January 2019 13:37



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